One Silicon Interposer, eight HBM3 stacks, and four sets of GPU or CPU Tiles
Serve The Home did its best to capture the event live with Dr. Lisa Su revealing AMD’s new AI Instinct MI300 chip. As the title says, the design is unique to AMD and features the new HBM3 aboard the chunky 153B transistor chip. The 192GB of HBM3 is paired with CDNA3 GPU IP blocks or AMD Zen 4 CPU IP blocks and communicates with the 5.2TB/s of memory bandwidth over an 896GB/s Infinity Fabric connection. That massive amount of memory and bandwidth should allow them to use fewer GPU stacks to do the same tasks as NVIDIA’s H100, which is the product AMD is trying to compete with.
The next generation Instinct will feature a model with three GPU tiles and one CPU tile, making it more flexible than this generation’s pure GPU or CPU chips; more Instinct MI300 can of course be combined to offer both. AMD also announced that the new Instinct MI300 supports CXL Type-3, something they haven’t done previously.